・Developed and adopted high-rigidity, high-sliding material that can be made into ALL resin. Significant price reduction is possible.
・In order to make the most of the sliding properties of the resin material, even if an undercut portion such as an E-ring groove is set at the end,
there is no parting line in the sealing portion or sliding portion is unnecessary.
・Since GF is not used to increase strength and is reinforced with inorganic fillers, wear reduction of seal materials can be expected.
・Since there is no P/L in the sealing part, the initial quality of the mold can be secured and stable mass production is possible.

・It has high thermal conductivity and slidability as a countermeasure against heat generation in copiers and printers, which are becoming smaller and faster,
　and can be expected to suppress local heat generation (40% or more) and reduce developer aggregation
・Since it has high slidability, it can be used without the metal sleeve used for the toner seal.
・Since it has a lower specific gravity than normal thermal conductive resin, it is possible to provide products at low cost.

・Our original technology mold structure can handle narrow pitch taperless screws.
　This contributes to the stabilization of the toner transport amount.
・It is possible to handle not only two-start screws but also three-start screws.